7 Specifications

7.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)

MIN

MAX

UNIT

0

7

V

Signal input pins

Common-mode voltage (2) (3)

– 0.5

6.0

V

Differential voltage (2) (3)

±6.0

V

Current (3)

–10

10

mA

Output short-circuit (4)

Continuous

–55

150

°C

150

°C

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

(2)

Input pins can swing beyond (V+) as long as they stay with in 6.0 V. No diode structure from input pins to (V+).

(3)

Input pins are diode-clamped to (V–). Input signals that 0.3 V below (V–) must be current-limited to 10 mA or less.

(4)

Short-circuit to ground, one amplifier per package.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1)

±4000

V

Charged-device model (CDM), per JEDEC specification JS-002 (2)

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage, (V+) – (V–)

1.5

5.5

V

Input voltage range

– 0.1

5.6

V

Specified temperature

–40

125

°C

7.4 Thermal Information for Single Channel

THERMAL METRIC (1)

OPA310

OPA310S

UNIT

DBV (2)

(SOT-23)

DCK (2)

(SC70)

DPW (2)

(X2SON)

DRL (2)

(X2SON)

DBV (2)

(SOT-23)

DCK (2)

(SC70)

5 PINS

5 PINS

5 PINS

5 PINS

6 PINS

6 PINS

Junction-to-ambient thermal resistance

TBD

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-case (top) thermal resistance

TBD

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-board thermal resistance

TBD

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-top characterization parameter

TBD

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-board characterization parameter

TBD

TBD

TBD

TBD

TBD

TBD

°C/W

Junction-to-case (bottom) thermal resistance

TBD

TBD

TBD

TBD

TBD

TBD

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

This package option is on preview.

OPA310, OPA2310, OPA4310

SBOSAA1B – APRIL 2022 – REVISED JULY 2022

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