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WSLP датащи(PDF) 3 Page - Vishay Siliconix |
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WSLP датащи(HTML) 3 Page - Vishay Siliconix |
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3 / 4 page ![]() WSLP www.vishay.com Vishay Dale Upgrade for Wider Resistance Range to WFM Revision: 09-Aug-2022 3 Document Number: 30122 For technical questions, contact: ww2bresistors@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 DERATING PULSE CAPABILITY www.vishay.com/resistors/power-metal-strip-calculator WELDED CONSTRUCTION Notes • Embossed carrier tape per EIA-481 (1) Additional packaging details at www.vishay.com/doc?20051 70 120 100 80 60 40 20 0 - 65 - 50 - 25 0 25 50 75 100 125 150 170 Ambient Temperature in °C IILLLL US TR AT AA IVE PU RRPP OS EESS O ON LYY LLLL click to get started PERFORMANCE TEST CONDITIONS OF TEST TEST LIMITS Thermal shock -55 °C to +150 °C, 1000 cycles, 15 min at each extreme ± (0.5 % + 0.0005 Ω) )Short time overload Refer to link for short time overload performance and pulse capability; www.vishay.com/resistors/power-metal-strip-calculator/ ± (0.5 % + 0.0005 Ω) Low temperature operation -65 °C for 24 h ± (0.5 % + 0.0005 Ω) High temperature exposure 1000 h at +170 °C ± (1.0 % + 0.0005 Ω) Bias humidity +85 °C, 85 % RH, 10 % bias, 1000 h ± (0.5 % + 0.0005 Ω) Mechanical shock 100 g’s for 6 ms, 5 pulses ± (0.5 % + 0.0005 Ω) Vibration Frequency varied 10 Hz to 2000 Hz in 1 min, 3 directions, 12 h ± (0.5 % + 0.0005 Ω) Load life 1000 h at 70 °C, 1.5 h “ON”, 0.5 h “OFF” ± (1.0 % + 0.0005 Ω) Resistance to solder heat +260 °C solder, 10 s to 12 s dwell, 25 mm/s emergence ± (0.5 % + 0.0005 Ω) Moisture resistance MIL-STD-202, method 106, 0 % power, 7b not required ± (0.5 % + 0.0005 Ω) PACKAGING (1) MODEL REEL TAPE WIDTH DIAMETER PIECES / REEL CODE WSLP0603 8 mm / punched paper 178 mm / 7" 5000 EA WSLP0805 8 mm / punched paper 178 mm / 7" 5000 EA WSLP1206 8 mm / embossed plastic 178 mm / 7" 4000 EA WSLP2010 12 mm / embossed plastic 178 mm / 7" 4000 EA WSLP2512 12 mm / embossed plastic 178 mm / 7" 2000 EA 2 1 3 4 Resistive element: solid metal nickel-chrome or manganese-copper alloy resistive element with low TCR (< 20 ppm/°C) 1 4 Silicone coating with ink print 3 Terminal / element weld 2 Terminal: solid copper, 100 % Sn (200 μ" min.) with 100 % Ni (40 μ" min.) under layer finish |
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