VR25, VR37, VR68

www.vishay.com

Vishay BCcomponents

Revision: 02-Jun-2022

7

Document Number: 28907

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

TESTS PROCEDURES AND REQUIREMENTS

All tests are carried out in accordance with the following

specifications:

EN 60115-1, generic specification

IEC 60068-2-xx, test methods

The table presents only the most important tests, for the full

test schedule refer to the documents listed above. However,

some additional tests and a number of improvements

against those minimum requirements have been included.

The tests are carried out under standard atmospheric

conditions in accordance with IEC 60068-1, 4.3, whereupon

the following values are applied:

Temperature: 15 °C to 35 °C

Relative humidity: 25 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)

A climatic category LCT/ UCT / 56 is applied, defined by the

lower category temperature (LCT = -55 °C), the upper

category temperature (UCT = 155 °C), and the duration of

exposure in the damp heat, steady state test (56 days). The

components are mounted for testing on printed circuit

boards in accordance with IEC 60115-1, 5.5 unless

otherwise specified.

TESTS PROCEDURES AND REQUIREMENTS

IEC 60115-1

CLAUSE

IEC 60068-2

TEST METHOD

TEST

PROCEDURE

REQUIREMENTS

PERMISSIBLE CHANGE

(

12.1

Insulation resistance

U

R

Ω

12.2

Voltage proof

U

No breakdown or flashover

6.2

Temperature coefficient

At (20 / -55 / 20) °C and (20 / 155 / 20) °C

≤ ± 200 ppm/K

6.6

Current noise

IEC 60195

VR25: max. 5 μV/V

VR37: max. 2.5 μV/V

VR68: max. 2.5 μV/V

8.1

Short term overload

Room temperature; 2.5 x

;

(voltage not more than 2 x limiting voltage);

10 cycles; 5 s ON and 45 s OFF

ΔR max.: ± 2 % R

9.5

21 (Ua1)

21 (Ub)

21 (Uc)

Robustness of

terminations

Tensile, bending, and torsion

No damage

ΔR max.: ± 0.5 % R

11.1

20 (Ta)

Solderability

+235 °C; 2 s; solder bath method; SnPb40

+245 °C; 3 s; solder bath method; SnAg3Cu0.5

(before aging)

Good tinning (

≥ 95 % covered);

no damage

+235 °C; 2 s; solder bath method; SnPb40

+245 °C; 3 s; solder bath method; SnAg3Cu0.5

(after aging)

Good tinning (

≥ 95 % covered);

no damage

11.2

20 (Tb)

Resistance to

soldering heat

Unmounted components

(260 ± 5) °C; (10 ± 1) s

ΔR max.: ± 0.5 % R

10.1

14 (Na)

Rapid change

of temperature

30 min at -55 °C and 30 min at +155 °C;

5 cycles

ΔR max.: ± 0.5 % R

9.9

27 (Ea)

Bump

3 x 1500 bumps in 3 directions; 40 g

No damage

ΔR max.: ± 0.5 % R

9.11

6 (Fc)

Vibration

10 sweep cycles per direction;

10 Hz to 2000 Hz;

No damage

ΔR max.: ± 0.5 % R

10.3

Climatic sequence:

R

Ω

ΔR max.: ± 1.5 % R

10.3.4.2

2 (Bb)

Dry heat

16 h; 155 °C

10.3.4.3

30 (Db)

Damp heat (accelerated)

1st cycl

24 h; 25 °C to 55 °C;

90 % to 100 % RH

10.3.4.4

1 (Ab)

Cold

2 h; -55 °C

10.3.4.5

13 (M)

Low air pressure

2 h; 8.5 kPa;

15 °C to 35 °C

10.3.4.6

30 (Db)

Damp heat

remaining cyclic

5 days; 55 °C;

95 % to 100 % RH; 5 cycles

10.3.4.7

DC load

Apply rated power for 1 min

P