PHPA

www.vishay.com

Vishay Dale Thin Film

Revision: 27-May-2021

3

Document Number: 60160

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Notes

• Chip surface temperature measured using FLIR A40 thermal

imaging system with an approximate test card surface

temperature of 25 °C

•Thermal imaging was conducted under ambient conditions

resulting in a steady state test card surface temperature of 85 °C

over the full range of power levels

• Thermal imaging and load life testing was conducted mounting

one device to 2" x 3" test cards with 2.5 mil copper plating on

both surfaces. Thermal vias on 120 mil centers were utilized for

heat transfer between surfaces of the test card

Notes

• Chip surface temperature measured using FLIR A40 thermal

imaging system with an approximate test card surface

temperature of 25 °C

STANDARD MATERIAL SPECIFICATIONS

Resistive Element

Tantalum nitride

Substrate Material

Terminations (Lead (Pb)-Free)

Tin solder plate over nickel barrier

PHPA1206 SINGLE PULSE CURVE

PHPA1206 CHIP TEMP. VS. APPLIED POWER

10

100

1000

10000

0.1

1

10

100

1000

0.0001

0.001

0.01

0.1

1

10

Axis Title

Pulse Duration (s)

1 kΩ

49.9 Ω

100 Ω

10

100

1000

10000

0

1

2

3

4

5

6

7

8

9

10

60

80

100 120 140 160 180 200 220

Axis Title

Chip Surface Temperature (°C)

10 Ω

100 Ω

1 kΩ

10 kΩ

PHPA2512 SINGLE PULSE CURVE

PHPA2512 CHIP TEMP. VS. APPLIED POWER

Case Size

2512

2512

2512

Resistance

Value

Up to 10

Ω

Up to 100

Ω

Up to 1 k

Ω

Temperature

Power (W)

70

2.67

2.02

1.89

150

7.17

5.34

4.94

200

9.94

7.15

6.48

10

100

1000

10000

0.1

1

10

100

1000

0.0001

0.001

0.01

0.1

1

10

Axis Title

Pulse Duration (s)

1 kΩ

10 Ω

100 Ω

10

100

1000

10000

0

1

2

3

4

5

6

7

8

9

10

60

80

100 120 140 160 180 200 220

Axis Title

Chip Surface Temperature (°C)

10 Ω

100 Ω

1 kΩ

10 kΩ