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PL317F3 датащи(PDF) 2 Page - Cystech Electonics Corp.

номер детали PL317F3
подробное описание детали  Three Terminal Adjustable Output Positive Voltage Regulators
PDF  9 Pages
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производитель  CYSTEKEC [Cystech Electonics Corp.]
домашняя страница  http://www.cystekec.com
Logo CYSTEKEC - Cystech Electonics Corp.

PL317F3 датащи(HTML) 2 Page - Cystech Electonics Corp.

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CYStech Electronics Corp.
Spec. No. : C513F3
Issued Date : 2003.05.24
Revised Date :
. .
Page No. : 2/9
PL317F3
CYStek Product Specification
Electrical Characteristics(VI-VO=5V,IO=0.5A,TJ=0 to 125℃, unless otherwise noted)
Characteristics
Symbol Conditions
Min
Typ
Max
Unit
Line Regulation(Note 1)
Reg line
TA=25℃,3.0V≤VI-VO≤40V
-
0.01
0.04
%/V
Load Regulation(Note 1)
Reg load TA=25℃,10mA≤IO≤1.5A
VO≤5.0V
VO≥5.0V
-
-
5.0
0.1
25
0.5
mV
%VO
Thermal Regulation(Note 4) Reg therm TA=25℃, 20ms pulse
-
0.03
0.07
%VO/W
Adjust Pin Current
IAdj
-
50
100
µA
Adjust Pin Current Change ∆IAdj
2.5V≤VI-VO≤40V,10mA≤IL≤1.5A
PD≤20W
-
0.2
5.0
µA
Reference Voltage
Vref
3.0V≤VI-VO≤40V,10mA≤IO≤1.5A
PD≤20W
1.2
1.25
1.3
V
Temperature Stability
Ts
0≤TJ≤125℃
-
0.7
-
%VO
Minimum Load Current to
maintain Regulation
ILmin
VI-VO=40V
-
3.5
10
mA
Maximum Output Current Imax
VI-VO≤15V,PD≤20W
VI-VO≤40V,PD≤20W,TA=25℃
1. 5
0.15
2.2
0.4
-
-
A
RMS Noise
N
% of VO,TA=25℃,10Hz≤f≤10kHz
-
0.003
-
%VO
Ripple Rejection(Note 2)
RR
VO=10V,f=120Hz
Without CAdj
CAdj=10µF
-
66
65
80
-
-
dB
Long-Term Stability(Note 3) S
TJ=125℃,TA=25℃ for endpoint
measurements
-
0.3
1.0
%/1.0k
Hrs
Notes:1.Load and line regulation are specified at constant junction temperature. Changes in VO due to heating effects must be
taken into account separately. Pulse testing with low duty cycle is used.
2.CAdj, when used, is connected between the adjustment pin and ground.
3.Since long-term stability cannot be measured on each device before shipment, this specification is an engineering
estimate of average stability from lot to lot.
4.Power dissipation within an IC voltage regulator produces a temperature gradient on the die, affecting individual IC
components on the die. These effects can be minimized by proper integrated circuit design and layout techniques.
Thermal regulation is the effect of these temperature gradients on the output voltage and is expressed in percentage
of output change per watt of power change in a specified time.



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