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7. Switch Handling Precautions
7.1 In case an automatic flow soldering apparatus is used for soldering, adhere to the following
conditions:
It e m
S o l d e r i n g c o ndit i o n
7.1.1. Preheat Temperature
100℃ max
(Ambient temperature of printed circuit board on
its soldering side)
7.1.2. Preheat Time
45 sec max.
7.1.3. Flux Foaming
To such an extent that fluxes will be kept flush with
the printed circuit board‘s top surface on which
components are mounted.
Preparatory flux must not be applied to that side of
printed circuit board on which components are
mounted and to the area where terminals located.
7.1.4. Soldering Temperature
255℃ max.
7.1.5. Duration of Solder Immersion
5 sec. max.
7.1.6. Allowable Frequency of Soldering process
2 times max.
7.2 Other precautions
7.2.1. Following the soldering process, do not try to clean the switch with a solvent or the like.
7.2.2. Safeguard the switch assembly against flux penetration from its topside.
7.2.3. Please have the products keep in close status and the storage time is 90 days guaranty after
delivering the goods at most.
PART NO:
TS6601H
6/6
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