Buffer/Clock Driver

MDS LV810 F

3

Revision 101305

Integrated Circuit Systems, Inc.

ICSLV810

External Components

The ICSLV810 requires a minimum number of external

components for proper operation.

Decoupling Capacitors

Decoupling capacitors of 0.01µF must be connected

between VDD and GND, as close to these pins as

possible. For optimum device performance, the

decoupling capacitors should be mounted on the

component side of the PCB. Avoid the use of vias in the

decoupling circuit.

Series Termination Resistor

When the PCB trace between the clock outputs and the

loads are over 1 inch, series termination should be

used. To series terminate a 50

Ω trace (a commonly

used trace impedance) place a 33

Ω resistor in series

with the clock line, as close to the clock output pin as

possible. The nominal impedance of the clock output is

20

Ω.

PCB Layout Recommendations

For optimum device performance and lowest output

phase noise, the following guidelines should be

observed.

1) The 0.01µF decoupling capacitors should be

mounted on the component side of the board as close

to the VDD pins as possible. No vias should be used

between the decoupling capacitors and VDD pins. The

PCB trace to VDD pin should be kept as short as

possible, as should the PCB trace to the ground via.

2) To minimize EMI the 33

Ω series termination resistor,

if needed, should be placed close to the clock output.

Absolute Maximum Ratings

Stresses above the ratings listed below can cause permanent damage to the ICSLV810. These ratings,

which are standard values for ICS commercially rated parts, are stress ratings only. Functional operation of

the device at these or any other conditions above those indicated in the operational sections of the

specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can

affect product reliability. Electrical parameters are guaranteed only over the recommended operating

temperature range.

Recommended Operation Conditions

Item

Rating

Supply Voltage, VDD MAX

7 V

All Inputs and Outputs

-0.5 V to VDDA + 1.2 V

Ambient Operating Temperature

-40 to +85

°C

Storage Temperature

-65 to +150

°C

Junction Temperature

125

°C

Soldering Temperature

260

°C

Parameter

Min.

Typ.

Max.

Units

Ambient Operating Temperature

-40

+85

°C

Power Supply Voltage (measured with respect to GND), VDDA

1.425

2.625

V

Power Supply Voltage (measured with respect to GND), VDDB

1.425

2.625

V

Power Supply Voltage (measured with respect to GND), VDDC

1.425

2.625

V