MIC2171

DS20006355A-page 4

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2022 Microchip Technology Inc. and its subsidiaries

Breakdown Voltage

65

75

—

V

Oscillator

Frequency

88

100

112

kHz

—

85

—

115

—

Maximum Duty Cycle

80

90

95

%

—

Input Supply Voltage

Minimum Operating Voltage

—

2.7

3.0

V

—

Quiescent Current

—

7

9

mA

Supply Current Increase

—

9

20

mA

Note 1: Exceeding the absolute maximum rating may damage the device.

2: Devices are ESD sensitive. Handling precautions recommended.

3: For duty cycles (δ) between 50% and 95%, minimum guaranteed switch current is given by

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Symbol

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Operating Ambient Temperature

–40

—

+85

°C

—

Operating Junction Temperature

–40

—

+125

°C

—

Maximum Junction Temperature

—

—

+150

°C

—

Storage Temperature

–65

—

+150

°C

—

Lead Temperature

—

—

+300

°C

Soldering, 10 sec.

Package Thermal Resistances

Thermal Resistance 5-Pin TO-220-5

—

45

—

°C/W

Note 2

Thermal Resistance 5-Pin TO-263-5

—

45

—

Note 3

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.

2: Mounted vertically, no external heat sink, 1/4 inch leads soldered to PC board containing approximately 4

inch squared copper area surrounding leads.

3: All ground leads soldered to approximately 2 inches squared of horizontal PC board copper area.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Parameter

Symbol

Min.

Typ.

Max.

Units Conditions