SMX2_FAM_P60D080_D144_SDS

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2010. All rights reserved.

Objective short data sheet

PUBLIC

Rev. 1 — 1 September 2010

197210

6 of 12

NXP Semiconductors

P60D080 and P60D144

Secure high-performance dual interface smart card controller

6.

Ordering information

Table 2.

Feature table (EEPROM and RAM sizes without applied implementation of MIFARE Plus and/or

DESFire EV1)

Product

type

EEPROM

[KB]

user

ROM

[KB]

total

RAM

[KB]

CXRAM

[KB]

FXRAM

[KB]

Coprocessor

MMU

Copy

machines

ISO/

IEC 7816

IO pads

interface

option

Fame2 DES AES

P60D080

80

384

8.125

5.5

2.625

yes

yes

yes

yes

2

3

ISO/IEC 7816 +

ISO/IEC 14443

P60D144

144

384

8.125

5.5

2.625

yes

yes

yes

yes

2

3

ISO/IEC 7816 +

ISO/IEC 14443

Table 3.

Ordering information

Type number

Package

Name

Description

Version

P60D080PU15

FFC

12 inch wafer (sawn; 150

μm thickness; on film frame carrier;

electronic fail die marking according to SECSII format)

NAU000

P60D144PU15

P60D080PU75

FFC

12 inch wafer (sawn; 75

μm thickness; on film frame carrier;

electronic fail die marking according to SECSII format)

NAU000

P60D144PU75

P60D080PA4

MOB4

contactless chip card module (super 35 mm tape format, module

thickness 320

μm)

SOT500-2

P60D144PA4

P60D080PA6

MOB6

contactless chip card module (super 35 mm tape format, module

thickness 250

μm)

SOT500-3

P60D144PA6

P60D080PX1

PDM1.1

dual interface chip card module (Plug-in type; super 35 mm tape

format, 8-contact)

SOT658-3

P60D144PX1

P60D080PX0

PDM1.1

dual interface chip card module (super 35 mm tape format,

8-contact)

SOT658-3

P60D144PX0

P60D080PX30

Pd-PDM1.1

palladium plated dual interface chip card module (super 35 mm tape

format, 8-contact)

SOT658-3

P60D144PX30