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MPC7410EC датащи(PDF) 43 Page - NXP Semiconductors

номер детали MPC7410EC
подробное описание детали  MPC7410 RISC Microprocessor Hardware Specifications
PDF  56 Pages
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производитель  NXP [NXP Semiconductors]
домашняя страница  http://www.nxp.com
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MPC7410EC датащи(HTML) 43 Page - NXP Semiconductors

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MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1
Freescale Semiconductor
43
System Design Information
Figure 27. LGA Package Exploded Cross-Sectional View with Heat Sink Clip to PCB Option
The board designer can choose between several types of heat sinks to place on the MPC7410. There are several
commercially-available heat sinks for the MPC7410 from the following vendors:
Aavid Thermalloy
603-224-9988
70 Commercial Street, Suite 200
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
International Electronic Research Corporation (IERC)
818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Wakefield Engineering
603-635-2800
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at
a given air velocity, spatial volume, mass, attachment method, assembly, and cost.
Thermal
Heat Sink
LGA Package
Heat Sink
Clip
Printed-Circuit Board
Interface Material



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