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34LC02-I/P датащи(PDF) 31 Page - Microchip Technology

номер детали 34LC02-I/P
подробное описание детали  2-Kbit I2C Serial EEPROM Software Write-Protect
PDF  40 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

34LC02-I/P датащи(HTML) 31 Page - Microchip Technology

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 2007-2022 Microchip Technology Inc. and its subsidiaries
DS20002029G-page 31
34AA02/34LC02
RECOMMENDED LAND PATTERN
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
1.50
1.60
MILLIMETERS
0.50 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.25
Microchip Technology Drawing No. C04-129-MN Rev. B
NOM
8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
12
8
C
Contact Pad Spacing
2.90
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C
E
X1
Y1
Y2
X2
EV
EV
ØV
SILK SCREEN
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)



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