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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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MIC45116 датащи(PDF) 29 Page - Microchip Technology |
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MIC45116 датащи(HTML) 29 Page - Microchip Technology |
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29 / 42 page  2016 - 2022 Microchip Technology Inc. DS20005571B-page 29 MIC45116 7.2 Solder Paste Stencil Design (Recommended Stencil Thickness = 112.5 ±12.5 µm) The solder stencil aperture openings should be smaller than the periphery or large PCB exposed pads to reduce any chance of build-up of excess solder at the large exposed pad area which can result to solder bridging. The suggested reduction of the stencil aperture opening is typically 0.20 mm smaller than exposed metal trace. Please note that a critical requirement is to not duplicate land pattern of the exposed metal trace as solder stencil opening because the design and dimension values are different. Cyan-colored shaded pad areas indicate exposed trace keep-out area in Figure 7-2 and Figure 7-3. FIGURE 7-2: Solder Stencil Opening. FIGURE 7-3: Stack-Up of Pad Layout and Solder Paste Stencil. |
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