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MCP7940N-E/MS датащи(PDF) 48 Page - Microchip Technology

номер детали MCP7940N-E/MS
подробное описание детали  Battery-Backed I2C Real-Time Clock/Calendar with SRAM
PDF  58 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

MCP7940N-E/MS датащи(HTML) 48 Page - Microchip Technology

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MCP7940N
DS20005010J-page 48
 2011-2022 Microchip Technology Inc. and its subsidiares
Microchip Technology Drawing No. C04-129-MN Rev E Sheet 2 of 2
8-Lead Plastic Dual Flat, No Lead Package (MN) – 2x3x0.8 mm Body [TDFN]
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOM
MILLIMETERS
0.50 BSC
2.00 BSC
3.00 BSC
0.20 REF
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Contact-to-Exposed Pad
Contact Thickness
Exposed Pad Width
Exposed Pad Length
4. Dimensioning and tolerancing per ASME Y14.5M
3. Package is saw singulated
2. Package may have one or more exposed tie bars at ends.
Notes:
Contact Width
Overall Width
Overall Length
Contact Length
Standoff
Number of Pins
Overall Height
Pitch
K
0.20
Units
N
e
A
Dimension Limits
D
A3
A1
b
D2
E2
E
L
0.20
1.35
1.25
0.25
0.00
0.70
MIN
-
-
0.25
0.30
1.30
1.40
1.35
0.30
0.45
1.45
8
0.75
0.02
0.05
0.80
MAX
With 1.4x1.3 mm Exposed Pad (JEDEC Package type WDFN)



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