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AS4LC2M8S0 датащи(PDF) 11 Page - Alliance Semiconductor Corporation

номер детали AS4LC2M8S0
подробное описание детали  3.3V 2M 횞 8/1M 횞 16 CMOS synchronous DRAM
PDF  29 Pages
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производитель  ALSC [Alliance Semiconductor Corporation]
домашняя страница  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS4LC2M8S0 датащи(HTML) 11 Page - Alliance Semiconductor Corporation

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AS4LC2M8S1
AS4LC1M16S1
5/21/01; v.1.1
Alliance Semiconductor
P. 11 of 29
Burst write
CS = CAS = WE = A10 = low;
RAS = high; A0~A9 = column
address; (A9 = don’t care for
2M × 8; A8, A9 = don’t care
for 1M × 16)
Use the Burst Write command to write data into the SDRAM on
consecutive clock cycles to adjacent column addresses. The burst
length and addressing mode is determined by the mode register
opcode. Input the initial write address in the same clock cycle as the
Burst Write command. Burst terminate behavior for write is the same
as that for read. Terminate the burst with a burst stop command,
precharge command to the same bank or another burst read/write.
DQM can also be used to mask the input data.
UDQM/LDQM (×16)
DQM (×8) operation
Use DQM to mask input and output data. It disables the output buffers
in a read operation and masks input data in a write operation. The
output data is invalid 2 clocks after DQM assertion (2 clock latency).
Input data is masked on the same clock as DQM assertion (0 clock
latency).
Burst stop
CS = WE = low; RAS = CAS =
high
Use burst stop to terminate burst operation. This command may be
used to terminate all legal burst lengths.
Bank precharge
CS = A10 = RAS = WE = low;
CAS = high; A11 = bank
select; A0~A9 = don’t care
The Bank Precharge command precharges the bank specified by A11.
The precharged bank is switched from active to idle state and is ready
to be activated again. Assert the precharge command after tRAS(min) of
the bank activate command in the specified bank. The precharge
operation requires a time of tRP(min) to complete.
Precharge all
CS = RAS = WE = low; CAS =
A10 = high; A11, A0~A9 =
don’t care
The Precharge All command precharges both banks simultaneously.
Both banks are switched to the idle state on precharge completion.
Auto precharge
Write: CS = CAS = WE = low ;
Read: CS = CAS = low;
A10 = high; A11 = bank select;
A0~A9 = column address;
(A9 = don’t care for 2M × 8; A8,
A9 = don’t care for 1M × 16)
During auto precharge, the SDRAM adjusts internal timing to satisfy
tRAS(min) and tRP for the programmed CAS latency and burst length.
Couple the auto precharge with a burst read/write operation by
asserting A10 to a high state at the same time the burst read/write
commands are issued. At auto precharge completion, the specified
bank is switched from active to idle state. Note that no new commands
(RD/WR/DEAC) can be issued to the same bank until the specified
bank achieves the idle state. Auto precharge does not work with full-
page burst.
Clock suspend/power
down mode entry
CKE = low
When CKE is low, the internal clock is frozen or suspended from the
next clock cycle and the state of the output and burst address are
frozen. If both banks are idle and CKE goes low, the SDRAM enters
power down mode at the next clock cycle. When in power down
mode, no input commands are acknowledged as long as CKE remains
low. To exit power down mode, raise CKE high before the rising edge
of CLK.
Clock suspend/power
down mode exit
CKE = high
Resume internal clock operation by asserting CKE high before the
rising edge of CLK. Subsequent commands can be issued one clock
cycle after the end of the Exit command.
Command
Pin settings
Description



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