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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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USB7006 датащи(PDF) 50 Page - Microchip Technology |
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USB7006 датащи(HTML) 50 Page - Microchip Technology |
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50 / 56 page  USB7006 DS00003715B-page 50 2022 Microchip Technology Inc. and its subsidiaries FIGURE 10-3: 100-VQFN PACKAGE (LAND-PATTERN) RECOMMENDED LAND PATTERN Dimension Limits Units C2 Optional Center Pad Width Contact Pad Spacing Optional Center Pad Length Contact Pitch Y2 X2 8.10 8.10 MILLIMETERS 0.40 BSC MIN E MAX 11.70 Contact Pad Length (X100) Contact Pad Width (X100) Y1 X1 1.05 0.20 Microchip Technology Drawing C04-2407A NOM SILK SCREEN 1 2 100 C1 C2 E X1 Y1 G1 Y2 X2 C1 Contact Pad Spacing 11.70 Contact Pad to Center Pad (X100) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV 0.33 1.20 ØV EV EV BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: Dimensioning and tolerancing per ASME Y14.5M For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process 1. 2. |
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