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MAX20002ATPA/V+ датащи(PDF) 3 Page - Maxim Integrated Products |
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MAX20002ATPA/V+ датащи(HTML) 3 Page - Maxim Integrated Products |
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3 / 19 page ![]() SUP, SUPSW, LX, EN to PGND ...........................-0.3V to +42V SUP to SUPSW....................................................-0.3V to +0.3V BIAS to AGND.........................................................-0.3V to +6V SPS, FOSC, COMP to AGND................-0.3V to (VBIAS + 0.3V) FSYNC, PGOOD, FB to AGND..............-0.3V to (VBIAS + 0.3V) OUT to PGND .......................................................-0.3V to +12V BST to LX................................................................-0.3V to +6V AGND to PGND....................................................-0.3V to +0.3V Output Short-Circuit Duration....................................Continuous Continuous Power Dissipation (TA = +70°C) 20-Pin TQFN (derate 33.3mW/°C above +70°C) ..2666.7mW Operating Temperature Range......................... -40°C to +125°C Junction Temperature .....................................................+150°C Storage Temperature Range............................ -65°C to +150°C Lead Temperature (soldering, 10s) .................................+300°C Soldering Temperature (reflow).......................................+260°C (VSUP = VSUPSW = 14V, VEN = 14V, L1 = 2.2µH, CIN = 4.7µF, COUT = 44µF, CBIAS = 2.2µF, CBST = 0.1µF, RFOSC = 12kΩ, TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C.) Electrical Characteristics PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Supply Voltage VSUP, VSUPSW 3.5 36 V Load-Dump Event Supply Voltage VSUP_LD tLD < 1s 42 V Supply Current ISUP Skip mode, no load, VOUT = 3.3V, VFSYNC = 0V 15 30 µA Skip mode, no load, VOUT = 5V, VFSYNC = 0V 20 35 µA Shutdown Supply Current ISHDN VEN = 0V 5 10 µA BIAS Regulator Voltage VBIAS VSUP = VSUPSW = 6V to 42V, IBIAS = 0 to 10mA 4.7 5 5.4 V BIAS Undervoltage Lockout VUVBIAS VBIAS rising 2.9 3.15 3.4 V PACKAGE TYPE: 20 TQFN Package Code T2055+4C Outline Number 21-0140 Land Pattern Number 90-0009 PACKAGE TYPE: 20 SW TQFN Package Code T2055Y+4C Outline Number 21-100165 Land Pattern Number 90-100065 THERMAL RESISTANCE, FOUR-LAYER BOARD Junction to Ambient (θJA) 30°C/W Junction to Case (θJC) 2°C/W . www.maximintegrated.com Maxim Integrated │ 3 MAX20002/MAX20003 36V, 220kHz to 2.2MHz, 2A/3A Fully Integrated Step-Down Converters with 15μA Operating Current Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status. Package Information |
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