2354µm (0.0927")

1754µm

(0.0691")

VSC7991

50µm

(0.002")

50µm

(0.002")

NOTE: All dimensions are in micrometers. The 48 pads specified in the pad coordinates were merged into 24 larger pads.

Die Size: 2354µm x 1754µm (0.0927" x 0.0691")

Die Thickness: 381µm (0.015")

Pad Pitch: 150µm (0.0059")

Pad Size: 116µm x 116µm (0.0046" x 0.0046")

Pad Passivation Opening: 100µm x 100µm (0.0039" x 0.0039")

Scribe Size: 50µm (0.002")

IB

Pad 35

GND

Pad 36

GND

Pad 20

GND

Pad 19

IP

Pad 22

IP

Pad 21

VSS

Pad 17

VSS

Pad 16

VSS

Pad 15

VSS

Pad 14

VSS

Pad 42

VSS

Pad 43

VSS

Pad 44

VSS

Pad 45

GND

Pad 37

GND

Pad 38

GND

Pad 39

GND

Pad 40

GND

Pad 41

DCC

Pad 13

GND

Pad 11

GND

Pad 12

GND

Pad 46

GND

Pad 47

GND

Pad 48

VIP

Pad 18

NDIN

Pad 2

GND

Pad 1

GND

Pad 4

GND

Pad 3

GND

Pad 6

GND

Pad 7

DIN

Pad 8

GND

Pad 9

NC

Pad 10

GND

Pad 5

DOUT

Pad 32

GND

Pad 33

IB

Pad 34

IBN

Pad 23

IBN

Pad 24

GND

Pad 30

GND

Pad 31

GND

Pad 28

GND

Pad 27

NDOUT

Pad 26

GND

Pad 25

GND

Pad 29