MIC5252

DS20006579B-page 14

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2021 - 2022 Microchip Technology Inc.

6-Lead 2mm × 2mm VDFN Package Outline and Recommended Land Pattern

B

A

0.05 C

0.05 C

0.10

C A B

0.05

C

(DATUM B)

(DATUM A)

C

SEATING

PLANE

1

4

N

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 1

1

4

N

0.10

C A B

0.10

C A B

0.10 C

0.05 C

Microchip Technology Drawing C04-1016A Sheet 1 of 2

D

E

A

(A3)

6X b

e

2X

D2

E2

K

L

6X

A1

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

6-Lead Very Thin Plastic Dual Flat, No Lead Package (JDA) - 2x2 mm Body [VDFN]

Micrel Legacy Package

3

NOTE 1

3