MIC5207

DS20005719C-page 6

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2017 - 2022 Microchip Technology Inc. and its subsidiaries

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 5 sec.

Junction Temperature

–40

—

+125

°C

All, except 1.8V

Junction Temperature

0

—

+125

°C

1.8V only

Package Thermal Resistance

Thermal Resistance SOT-23

—

235

—

°C/W

—

—

130

—

—

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.