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DS20005718D-page 5

MIC5201

Reference (MIC5201 Adjustable Version Only)

Reference Voltage

1.223

1.242

1.255

V

—

1.217

—

1.267

Reference Voltage

Temperature Coefficient

—

20

—

ppm/°C Note 7

Note 1: Specification for packaged product only. Devices are ESD sensitive. Handling precautions recommended.

2: Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total

temperature range.

3: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are

tested for load regulation in the load range from 0.1 mA to 150 mA. Changes in output voltage due to heat-

ing effects are covered by the thermal regulation specification.

4: Dropout Voltage is defined as the input to output differential at which the output voltage drops 2% below its

nominal value measured at 1V differential.

5: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current

drawn from the supply is the sum of the load current plus the ground pin current.

6: Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipa-

7: Design guidance only. Not production tested.

ELECTRICAL CHARACTERISTICS (CONTINUED)

Parameter

Symbol

Min.

Typ.

Max.

Units

Conditions

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Junction Temperature Range

–40

—

+85

°C

—

Lead Temperature

—

—

—

+260

°C

Soldering, 5 sec.

Package Thermal Resistance

Thermal Resistance SOT-223

—

15

—

°C/W

See Thermal

Considerations Layout

for more information.

—

62

—

Thermal Resistance 8-Lead SOIC

—

160

—

°C/W

See Thermal

Considerations Layout

for more information.

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +85°C rating. Sustained junction temperatures above +85°C can impact the device reliability.