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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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STM32F072X8 датащи(PDF) 100 Page - STMicroelectronics |
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STM32F072X8 датащи(HTML) 100 Page - STMicroelectronics |
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100 / 128 page  Package information STM32F072x8 STM32F072xB 100/128 DS9826 Rev 6 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA100 package information UFBGA100 is a 100-ball, 7 × 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array package. Figure 35. UFBGA100 package outline 1. Drawing is not to scale. Table 71. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 0.600 - - 0.0236 A1 - - 0.110 - - 0.0043 A2 - 0.450 - - 0.0177 - A3 - 0.130 - - 0.0051 0.0094 A4 - 0.320 - - 0.0126 - A0C2_ME_V5 Seating plane A1 e Z Z D M Øb (100 balls) A E TOP VIEW BOTTOM VIEW 1 12 A1 ball identifier e A A2 Y X Z ddd Z D1 E1 eee ZY X fff Ø Ø M M Z A3 A4 A1 ball index area |
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