Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

Pin Functions.................................................................... 3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................4

6.4 Thermal Information....................................................4

6.5 Electrical Characteristics.............................................5

6.6 Switching Characteristics............................................5

6.7 Timing Characteristics.................................................6

6.8 Typical Characteristics................................................ 7

7 Parameter Measurement Information............................ 8

8 Detailed Description........................................................9

8.1 Overview..................................................................... 9

8.2 Functional Block Diagram........................................... 9

8.3 Feature Description.....................................................9

8.4 Device Functional Modes..........................................10

9 Application and Implementation.................................. 11

9.1 Application Information..............................................11

9.2 Typical Application.................................................... 11

10 Power Supply Recommendations..............................14

11 Layout........................................................................... 14

11.1 Layout Guidelines................................................... 14

11.2 Layout Example...................................................... 14

12 Device and Documentation Support..........................15

12.1 Documentation Support.......................................... 15

12.2 Receiving Notification of Documentation Updates..15

12.3 Support Resources................................................. 15

12.4 Trademarks.............................................................15

12.5 Electrostatic Discharge Caution..............................15

12.6 Glossary..................................................................15

13 Mechanical, Packaging, and Orderable

Information.................................................................... 16

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (January 2021) to Revision D (December 2021)

Page

• Added DYY package information to Device Information.....................................................................................1

• Added DYY package information to Pin Configuration and Functions .............................................................. 3

•

Added DYY package to Thermal Information table........................................................................................... 4

Changes from Revision B (November 2020) to Revision C (January 2021)

Page

• Changed BQA package status from Preview to Active.......................................................................................1

• Changed data sheet status from Mixed Status to Production Data.................................................................... 1

Changes from Revision A (May 2020) to Revision B (November 2020)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Added BQA package information to Device Information.................................................................................... 1

• Added BQA pinout diagram and package information to Pin Configuration and Functions .............................. 3

• Added BQA package to Thermal Information table............................................................................................ 4

Changes from Revision * (November 2019) to Revision A (May 2020)

Page

• Added D package information to Device Information......................................................................................... 1

• Added D package information to Pin Configuration and Functions ................................................................... 3

• Added D package column to Thermal Information table.....................................................................................4

SN74HCS74

SCLS782D – NOVEMBER 2019 – REVISED DECEMBER 2021

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