1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

27

26

25

24

23

22

21

20

19

36

35

34

33

32

31

30

29

28

Σ

BIAS

LO2

BIAS

LO1

90

°

0

°

BIAS

LO3

GND

BBI+

BBI-

GND

RF

RF

GND

BBQ-

BBQ+

Q+

Q-

GND

I-

I+

C9

8.2pF

C8

0.1

µF

C7

33pF

C5

0.1

µF

C6

33pF

GND

GND

GND

GND

GND

GND

GND

GND

GND

RBIASLO3

R3

332

Ω

C1

33pF

C3

82pF

C2

0.1

µF

VCCLOA

LO

GND

RBIASLO1

R1

432

Ω

N.C.

RBIASLO2

C11

0.1

µF

C10

33pF

C12

0.1

µF

C13

33pF

GND

GND

GND

GND

GND

GND

GND

MAX2021

R2

619

Ω

Typical Application Circuit

High-Dynamic-Range, Direct Up-/Downconversion

750MHz to 1200MHz Quadrature Mod/Demod

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

14 ____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600

© 2006 Maxim Integrated Products

Printed USA

is a registered trademark of Maxim Integrated Products, Inc.

COMPONENT

VALUE

DESCRIPTION

C1, C6, C7, C10, C13

33pF

33pF ±5%, 50V C0G ceramic capacitors (0402)

C2, C5, C8, C11, C12

0.1µF

0.1µF ±10%, 16V X7R ceramic capacitors (0603)

C3

82pF

82pF ±5%, 50V C0G ceramic capacitor (0402)

C9

8.2pF

8.2pF ±0.1pF, 50V C0G ceramic capacitor (0402)

R1

432

Ω

432

Ω ±1% resistor (0402)

R2

619

Ω

619

Ω ±1% resistor (0402)

R3

332

Ω

332

Ω ±1% resistor (0402)

Table 3. Component List Referring to the Typical Application Circuit

Package Information

For the latest package outline information, go to

www.maxim-ic.com/packages.

Chip Information

PROCESS: SiGe BiCMOS