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STM8S103F2 датащи(PDF) 119 Page - STMicroelectronics |
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STM8S103F2 датащи(HTML) 119 Page - STMicroelectronics |
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119 / 121 page ![]() DocID15441 Rev 14 119/121 STM8S103F2 STM8S103F3 STM8S103K3 Revision history 120 04-Apr-2012 8 Updated notes related to VCAP in Table 19: General operating conditions. Added values of tR/tF for 50 pF load capacitance, and updated note in Table 38: I/O static characteristics. Updated typical and maximum values of RPU in Table 38: I/O static characteristics and Table 42: NRST pin characteristics. Changed SCK input to SCK output in Section 10.3.8: SPI serial peripheral interface Modified Figure 51: UFQFPN20 - 20-lead, 3x3 mm, 0.5 mm pitch, ultra thin fine pitch quad flat package outline to add package top view. 26-Jun-2012 9 Added Section 11.4: SDIP32 package information. 04-Feb-2015 10 Updated Section 11.5: TSSOP20 package information and Section 11.3: UFQFPN20 package information. 10-Mar-2015 11 Updated: – Table 34: HSI oscillator characteristics: corrected HSI oscillator accuracy (factory calibrated) for VDD = 5 V and TA = 25 °C. – Table 38: I/O static characteristics: corrected the max. value for TR/TF, Fast I/Os, Load = 50 pF. Added: – Figure 23: Typical pull-up current vs VDD @ 4 temperatures, – the rows for TR/TF, Fast I/Os, Load = 20 pF in Table 38: I/O static characteristics, – Figure 47: LQFP32 marking example (package top view), – Figure 50: UFQFPN32 marking example (package top view), – Figure 53: UFQFPN20 marking example (package top view), – Figure 55: SDIP32 marking example (package top view), – Figure 58: TSSOP20 marking example (package top view), – Figure 60: SO20 marking example (package top view). 26-Mar-2015 12 Corrected the values for “b” dimensions in Table 53: UFQFPN32 - 32- pin, 5x5 mm, 0.5 mm pitch ultra thin fine pitch quad flat package mechanical data. Table 59. Document revision history Date Revision Changes |
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