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STM32H750VB датащи(PDF) 20 Page - STMicroelectronics |
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STM32H750VB датащи(HTML) 20 Page - STMicroelectronics |
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20 / 337 page ![]() Description STM32H750VB STM32H750ZB STM32H750IB STM32H750XB 20/336 DS12556 Rev 6 Operating temperatures Ambient temperatures: –40 up to +85 °C(6) Junction temperature: –40 to + 125 °C Package LQFP100 LQFP144 LQFP176, UFBGA176+25 TFBGA240+25 1. The SPI1, SPI2 and SPI3 interfaces give the flexibility to work in an exclusive way in either the SPI mode or the I2S audio mode. 2. The maximum CPU frequency of 480 MHz can be obtained on devices revision V. 3. The product junction temperature must be kept within the –40 to +105 °C temperature range. 4. Since the LQFP100 package does not feature the PDR_ON pin (tied internally to VDD), the minimum VDD value for this package is 1.71 V. 5. VDD/VDDA can drop down to 1.62 V by using an external power supervisor (see Section 3.5.2: Power supply supervisor) and connecting PDR_ON pin to VSS. Otherwise the supply voltage must stay above 1.71 V with the embedded power voltage detector enabled. 6. The product junction temperature must be kept within the –40 to +125 °C temperature range. Table 1. STM32H750xB features and peripheral counts (continued) Peripherals STM32H750VB STM32H750ZB STM32H750IB STM32H750XB |
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