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поискавой системы для электроныых деталей |
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поискавой системы для электроныых деталей |
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ADP322ACPZ-165-R7 датащи(PDF) 22 Page - Analog Devices |
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ADP322ACPZ-165-R7 датащи(HTML) 22 Page - Analog Devices |
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22 / 24 page  ADP322/ADP323 Data Sheet Rev. E | Page 22 of 24 PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increasing the amount of copper attached to the pins of the ADP322/ ADP323. However, as can be seen from Table 7, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Place the input capacitor as close as possible to the VINx and GND pins. Place the output capacitors as close as possible to the VOUTx and GND pins. Use 0402 or 0603 size capacitors and resistors to achieve the smallest possible footprint solution on boards where area is limited. Figure 62. Example of PCB Layout, Top Side Figure 63. Example of PCB Layout, Bottom Side |
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