4.2

Thermal Specifications

The following table lists the thermal specifications for the PD69101 device.

Table 4-3. Thermal Specifications

Parameter

Value

Typical thermal resistance: junction to ambient

25 °C/W

Typical thermal resistance: junction to case

4 °C/W

Typical thermal resistance: junction to board

2 °C/W

The θJA numbers are guidelines for the thermal performance of the device/pc-board system. All specifications

assume no ambient airflow.

4.3

Tape and Reel—Packaging Information

The following section provides the tape and reel packaging information. The following figure shows the tape

specification.

Figure 4-3. Tape Specification

The following table lists the tape mechanical data.

Table 4-4. Tape Mechanical Data

Dimension

Millimeters

A0

4.25 ±0.10

B0

5.40 ±0.10

K0

1.20 ±0.10

K1

—

Pitch

8.00 ±0.10

PD69101

Package Specifications

and its subsidiaries

Datasheet

DS00004280A-page 22