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DS20006092B-page 6

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2018 - 2022 Microchip Technology Inc. and its subsidiaries.

TEMPERATURE SPECIFICATIONS (Note 1)

Parameters

Sym.

Min.

Typ.

Max.

Units

Conditions

Temperature Ranges

Storage Temperature Range

–65

—

+150

°C

—

Junction Operating Temperature

—

—

+150

°C

—

Ambient Operating Temperature Range

–40

—

+85

°C

B Version

0

—

+70

C Version

Lead Temperature

—

—

—

+300

°C

Soldering, 10s

Package Thermal Resistances

Thermal Resistance, 8-Lead MSOP

—

250

—

°C/W —

Thermal Resistance, 5-Lead TO-220

—

10

—

°C/W —

Thermal Resistance, 8-Lead PDIP

—

125

—

°C/W —

Thermal Resistance, 8-Lead SOIC

—

155

—

°C/W —

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

maximum allowable power dissipation will cause the device operating junction temperature to exceed the

maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.