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2021 Microchip Technology Inc. and its subsidiaries

DS20006625A-page 13

MIC69301/2/3

5.0

PACKAGING INFORMATION

5.1

Package Marking Information

Example

8-Lead Adj. SOIC*

XXX

XXXXXXXX

WNNN

X

XXXXX

WNNN

Example

5-Lead Fixed S-PAK*

XXXXX

-X.XXX

WNNN XXX

69301

-1.2WR

5246 USA

Example

5-Lead Adj. S-PAK*

XXXXX

XX

WNNN XXX

69302

WR

6524 USA

Example

5-Lead Fixed TO-263*

XXXXX

-X.XXX

WNNNP

69301

-1.2WU

5246P

Example

5-Lead Adj. TO-263*

XXXXX

XX

WNNNP

69302

WU

6524P

MIC

69303YME

3719

Example

8-Lead Fixed SOIC*

XXXXX

-X.XXXX

WNNN

69301

-1.2YME

9371

Example

12-Lead DFN*

Y

69303

6270

Legend: XX...X Product code or customer-specific information

Y

Year code (last digit of calendar year)

YY

Year code (last 2 digits of calendar year)

WW

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

*

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle

mark).

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available

characters for customer-specific information. Package may or may not include

the corporate logo.

Underbar (_) and/or Overbar (‾) symbol may not be to scale.

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