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MDEV-433-RM датащи(PDF) 3 Page - Linx Technologies

номер детали MDEV-433-RM
подробное описание детали  RM SERIES RECEIVER MODULE DATA GUIDE
PDF  16 Pages
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производитель  LINX [Linx Technologies]
домашняя страница  https://linxtechnologies.com/wp/
Logo LINX - Linx Technologies

MDEV-433-RM датащи(HTML) 3 Page - Linx Technologies

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PIN DESCRIPTION
Pin 1
RF IN
The receiver antenna connects to this input.It is AC-coupled and has nominal RF
impedance of 50
Ω.
Pin 2 & 4
GROUND
This pin should be connected to a common groundplane.
Pin 3
DETECT
This pin may be used as described in this manual to derive an indication of when
a signal is being received. In combination with simple external circuits the pin is
useful for qualifying data and implementing power-save functions . If the detect
function is not being used, a 10 K
Ω pull up to pin 5 (Vcc) should be connected.
Pin 5
Vcc
Positive supply of 4 to 9 volts. The supply must be clean (<20 mV pp) stable and
free of high-frequency digital noise. A supply filter is recommended unless the
module is driven from its own regulated supply or battery.
Pin 6
AF (ANALOG OUTPUT)
This is the FM demodulator output. It has a standing DC bias of approximately 2
volts and may be used to recover analog signals such as audio or tones. Load
impedance as low as 2 K
Ω and up to 100 pF can be driven.
Pin 7
DATA (DIGITAL OUTPUT)
This digital output from the internal data slicer is a squared version of the signal
on pin 6 (AF). This signal is used to interface with external digital decoders, or
logic devices such as a microprocessor. The output recreates the digital input to
the transmitter. Load impedance as low as 1 K
Ω and up to 1 nF can be driven.
PHYSICAL PACKAGING
The receiver is packaged as a hybrid SIP module with five pins spaced 0.100 in.
on center.The SIP package allows easy accommodation of both horizontal and
vertical mounting requirements into a highly compact package. Its leaded design
allows for easy prototyping and simple integration into through-hole and surface-
mount designs. If the module will be bent and laid flush on the circuit board, it is
suggested that a pad of silicon or other adhesive be used to hold it in place.
figure 2: mechanical dimensions



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