NXP Semiconductors

WLAN8101C

5 GHz Wi-Fi 6 Front-End Module

16.1 Advanced solder footprint

NXP recommends by default to apply the soldering and footprint guidelines as are released in

POD SOT2022-1.

Advanced PCB design guideline may be used when SOT2022-1 is applied with a non wet-able

flank design. However, care should be taken in the design of the stencil to ensure optimal solder

deposition.

ADVANCED PCB DESIGN GUIDELINE - I/O PADS

THIS SHEET SERVES ONLY AS A GUIDELINE TO HELP DEVELOP A USER SPECIFIC SOLUTION.

DEVELOPMENT EFFORT WILL STILL BE REQUIRED BY END USERS TO OPTIMIZE PCB MOUNTING PROCESSES AND

BOARD DESIGN IN ORDER TO MEET INDIVIDUAL//SPECIFIC REQUIREMENTS

STENCIL TECHNOLOGY SHOULD BE OPTIMIZED FOR OPTIMUM SOLDER DEPOSITION.

ADVANCED PCB DESIGN GUIDELINE - SOLDER MASK OPENING PATTERN

STANDARD PCB DESIGN GUIDELINE - SEE SOT2022-1 POD.

ADVANCED PCB DESIGN GUIDELINE:

aaa-035752

(2 x 1.7)

(2 x 1.6)

package outline

(2 x 0.166)

(4 x 1.3)

(34 x 0.325)

(34 x 0.25)

14 x 0.35

2 x 1.288

16 x 0.35

2 x 0.7

2 x 1.788

2 x 0.175

(2 x 0.14)

(2 x 1.2)

(34 x 0.225)

(34 x 0.15)

14 x 0.35

2 x 1.288

2 x 0.175

package outline

16 x 0.35

2 x 0.7

2 x 1.788

Figure 7. Advanced solder footprint

WLAN8101C

All information provided in this document is subject to legal disclaimers.

© NXP B.V. 2021. All rights reserved.

Product data sheet

Rev. 3 — 11 August 2020

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