SMF Series

300W Transient Voltage Suppression Diodes

Document Number: F12122A

19-JUL-2021 V 2.1

www.futurewafer.com.tw

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2. Contents

1. Synopsis.............................................................................................................................................. 1

1-1. General Description ................................................................................................................. 1

1-2. Feature List ............................................................................................................................... 1

1-3. Applications............................................................................................................................... 1

1-4. IEC Compatibility...................................................................................................................... 1

1-5. Mechanical Characteristics ..................................................................................................... 1

2. Contents .............................................................................................................................................. 2

3. Electrical Property............................................................................................................................. 3

3-1. Absolute Maximum Ratings .................................................................................................... 3

3-2. Electrical Characteristics (Tamb=25°C) ........................................................................................ 4

3-3. I-V Curve Characteristics ........................................................................................................ 5

3-4. Ratings and Characteristics Curve (TA=25°C unless otherwise noted) ............................................... 6

4. Soldering Parameters....................................................................................................................... 7

5. Package Information......................................................................................................................... 8

5-1. Dimension ................................................................................................................................. 8

5-2. PCB Pad Layout Recommendation ....................................................................................... 8

6. Packing ................................................................................................................................................ 9

6-1. Taping and Reel Specification................................................................................................ 9

6-2. Embossed Carrier Tape Specification ................................................................................... 9

6-3. Surface Mount Reel Specification ........................................................................................ 10

6-4. Tape Leader and Trailer Specification................................................................................. 10

7. Family Members............................................................................................................................... 11

8. Ordering Information ...................................................................................................................... 12

9. Version............................................................................................................................................... 12

9-1. History...................................................................................................................................... 12

9-2. Company Profile..................................................................................................................... 12