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TPS22950 датащи(PDF) 4 Page - Texas Instruments |
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TPS22950 датащи(HTML) 4 Page - Texas Instruments |
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4 / 26 page ![]() 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted)(1) MIN MAX UNIT VIN Maximum Input Voltage Range –0.3 6 V VOUT Maximum Output Voltage Range –0.3 6 V VON Maximum ON Pin Voltage Range –0.3 6 V VFLT Maximum FLT Pin Voltage –0.3 6 V IMAX Maximum Continuous Output Current 2.7 A IMAX,PLS Maximum Pulsed Output Current (TJ = 85°C, duty cycle = 2%) 4.1 A TSTG Storage temperature –65 150 °C TLEAD Maximum Lead Temperature (10 s soldering time) 300 °C (1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/ JEDEC JS-001, allpins(1) ±2000 V Charged device model (CDM), per JEDEC specificationJESD22-C101, all pins(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less is possible with the necessary precautions. Pins listed may actually have higher performance. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VIN Input Voltage Range 1.8 5.5 V VOUT Output Voltage Range 0 5.5 V VIH ON Pin High Voltage Range 1 5.5 V VIL ON Pin Low Voltage Range 0 0.35 V ILIM Output Current Limit 0.05 3.5 A TA Ambient temperature –40 125 °C TJ Junction temperature –40 150 °C 6.4 Thermal Information THERMAL METRIC(1) TPS22950 UNIT YBH (WCSP) 6 PINS RθJA Junction-to-ambient thermal resistance 135.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 39.5 °C/W RθJB Junction-to-board thermal resistance 1.4 °C/W ΨJT Junction-to-top characterization parameter 0.9 °C/W TPS22950 SLVSFJ2 – DECEMBER 2020 www.ti.com 4 Submit Document Feedback Copyright © 2021 Texas Instruments Incorporated Product Folder Links: TPS22950 |
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