TMUX7412FRRPR datasheet(3/42 Pages) TI

3 / 42 page

5 Device Comparison Table

PRODUCT

DESCRIPTION

TMUX7411F

±60 V Fault-protected, Latch-up Immune, Quad SPST Switch (Logic Low)

TMUX7412F

±60 V Fault-protected, Latch-up Immune, Quad SPST Switch (Logic High)

TMUX7413F

±60 V Fault-protected, Latch-up Immune, Quad SPST Switch (Logic Low + Logic High)

6 Pin Configuration and Functions

SEL1

SEL2

VSS

VDD

GND

SEL4

SEL3

Not to scale

Figure 6-1. (Preview) PW Package

16-Pin TSSOP, Top View

VSS

VDD

GND

Not to scale

Thermal

Pad

Figure 6-2. RRP Package

16-Pin WQFN, Top View

Table 6-1. Pin Functions

TYPE(1)

DESCRIPTION

NAME

TSSOP(2)

WQFN

I/O

Drain pin 1. Can be an input or output. The drain pin is not overvoltage protected.

I/O

Drain pin 2. Can be an input or output. The drain pin is not overvoltage protected.

I/O

Drain pin 3. Can be an input or output. The drain pin is not overvoltage protected.

I/O

Drain pin 4. Can be an input or output. The drain pin is not overvoltage protected.

General fault flag. This pin is an open drain output and is asserted low when overvoltage

condition is detected on any of the source (Sx) input pins. Connect this pin to an external

supply (1.8 V to 5.5 V) through a 1 kΩ pull-up resistor.

GND

Ground (0 V) reference

I/O

Overvoltage protected source pin 1. Can be an input or output.

I/O

Overvoltage protected source pin 2. Can be an input or output.

I/O

Overvoltage protected source pin 3. Can be an input or output.

I/O

Overvoltage protected source pin 4. Can be an input or output.

SEL1

Logic control input 1.

SEL2

Logic control input 2.

SEL3

Logic control input 3.

SEL4

Logic control input 4.

VDD

Positive power supply. This pin is the most positive power-supply potential. Connect a

decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND for reliable

operation.

VSS

Negative power supply. This pin is the most negative power-supply potential. This pin can be

connected to ground in single-supply applications. Connect a decoupling capacitor ranging

from 0.1 µF to 10 µF between VSS and GND for reliable operation.

Thermal Pad

—

The thermal pad is not connected internally. It is recommended that the pad be tied to GND or

VSS for best performance.

(1)

I = input, O = output, I/O = input and output, P = power.

(2)

Preview package.

www.ti.com

TMUX7411F, TMUX7412F, TMUX7413F

SCDS404A – MARCH 2021 – REVISED NOVEMBER 2021

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Product Folder Links: TMUX7411F TMUX7412F TMUX7413F

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