Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 5

6.1 Absolute Maximum Ratings ....................................... 5

6.2 ESD Ratings .............................................................. 5

6.3 Recommended Operating Conditions ........................5

6.4 Thermal Information for Single Channel .................... 5

6.5 Thermal Information for Dual Channel .......................6

6.6 Thermal Information for Quad Channel ..................... 6

6.7 Electrical Characteristics ............................................7

6.8 Typical Characteristics................................................ 9

7 Detailed Description......................................................16

7.1 Overview................................................................... 16

7.2 Functional Block Diagram......................................... 16

7.3 Feature Description...................................................17

7.4 Device Functional Modes..........................................24

8 Application and Implementation.................................. 25

8.1 Application Information............................................. 25

8.2 Typical Applications.................................................. 25

9 Power Supply Recommendations................................27

10 Layout...........................................................................27

10.1 Layout Guidelines................................................... 27

10.2 Layout Example...................................................... 27

11 Device and Documentation Support..........................30

11.1 Device Support........................................................30

11.2 Documentation Support.......................................... 30

11.3 Receiving Notification of Documentation Updates.. 30

11.4 Support Resources................................................. 30

11.5 Trademarks............................................................. 30

11.6 Electrostatic Discharge Caution.............................. 31

11.7 Glossary.................................................................. 31

12 Mechanical, Packaging, and Orderable

Information.................................................................... 32

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (February 2021) to Revision D (August 2021)

Page

• Removed preview note and added thermal data for VSSOP-8 (DGK) package in Thermal Information for Dual

Channel.............................................................................................................................................................. 6

Changes from Revision B (March 2020) to Revision C (February 2021)

Page

• Updated the numbering format for tables, figures, and cross-references throughout the document..................1

• Removed preview notation from TLV9302 SOT-23 (8) package from Device Information table........................ 1

• Removed preview notation from TLV9302 VSSOP (8) package from Device Information table........................ 1

• Removed Table of Graphs table from the Specifications section....................................................................... 9

• Removed Related Links section from the Device and Documentation Support section...................................30

Changes from Revision A (April 2019) to Revision B (March 2020)

Page

• Changed the TLV9301 and TLV9304 device statuses from Advance Information to Production Data ..............1

• Removed preview notation from TLV9301 SOT-23 (5) package from Device Information table........................ 1

• Removed preview notation from TLV9301 SC70 (5) package from Device Information table............................1

• Removed preview notation from TLV9304 SOIC (14) package from Device Information table..........................1

• Removed preview notation from TLV9304 TSSOP (14) package from Device Information table...................... 1

• Removed preview notation from TLV9301 DBV package (SOT-23) in the Pin Configuration and Functions

section................................................................................................................................................................ 3

• Removed preview notation from TLV9301 DCK package (SC70) in the Pin Configuration and Functions

section................................................................................................................................................................ 3

• Removed preview notation from TLV9304 D (SOIC) and TSSOP (PW) packages in the Pin Configuration and

Functions section................................................................................................................................................3

Changes from Revision * (February 2019) to Revision A (April 2019)

Page

• Changed the TLV9302 device status from Advance Information to Production Data ........................................1

TLV9301, TLV9302, TLV9304

SBOS941D – FEBRUARY 2019 – REVISED AUGUST 2021

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