MMA034AA

SMD-00173 Rev C

Subject to Change Without Notice

5 of 6

Die size, pad locations, and pad descriptions

Pick-up and Chip Handling:

This MMIC has exposed air bridges on the top surface. Do not pick up chip with vacuum

on the die center; handle from edges or with a custom collet.

Thermal Heat Sinking:

To avoid damage and for optimum performance, you must observe the maximum channel

temperature and ensure adequate heat sinking.

ESD Handling and Bonding:

This MMIC is ESD sensitive; preventive measures should be taken during handling, die attach,

and bonding.

Epoxy die attach is recommended. Please review our application note MM-APP-0001

handling and die attach recommendations, on our website for more handling, die attach

and bonding information.

Chip size: 1640x920um (64.6x36.2mil)

Chip size tolerance: ±5um (0.2mil)

Chip thickness: 100 ±10um (4 ±0.4mil)

Pad dimensions: 80x80um (3.1x3.1mil)