LM75B

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© NXP B.V. 2015. All rights reserved.

Product data sheet

Rev. 6.1 — 6 February 2015

3 of 37

NXP Semiconductors

LM75B

Digital temperature sensor and thermal watchdog

4.

Ordering information

[1]

LM75BGD cannot be production cold temperature tested because of manufacturing process constraints. Although no LM75BGD

complaints have been noted, NXP recommends consideration/use of the LM75BTP instead of the LM75BGD in operating environments

of less than 0

C.

4.1 Ordering options

Table 1.

Ordering information

Type

number

Topside

mark

Package

Name

Description

Version

LM75BD

LM75BD

SO8

plastic small outline package; 8 leads; body width 3.9 mm

SOT96-1

LM75BDP

LM75B

TSSOP8

plastic thin shrink small outline package; 8 leads; body width 3 mm

SOT505-1

LM75BGD[1]

75B

XSON8U

plastic extremely thin small outline package; no leads; 8 terminals;

UTLP based; body 3

 2  0.5 mm

SOT996-2

LM75BTP

M75

HWSON8 plastic thermal enhanced very very thin small outline package;

no leads; 8 terminals, 2

 3  0.8 mm

SOT1069-2

Table 2.

Ordering options

Type number

Orderable

part number

Package

Packing method

Minimum

order

quantity

Temperature

LM75BD

LM75BD,112

SO8

Standard marking * IC’s tube -

DSC bulk pack

2000

LM75BD,118

SO8

Reel 13” Q1/T1

*Standard mark SMD

2500

LM75BDP

LM75BDP,118

TSSOP8

Reel 13” Q1/T1

*Standard mark SMD

2500

LM75BGD

LM75BGD,125

XSON8U

Reel 7” Q3/T4 *Standard mark

3000

LM75BTP

LM75BTP,147

HWSON8

Reel 7” Q2/T3 *Standard mark

4000