ADP8140ACPZ-1-R7 datasheet(6/23 Pages) AD

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ADP8140

Data Sheet

Rev. B | Page 6 of 23

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

VIN, FB_OUT to GND

−0.3 V to +31 V

SINKx to GND

−0.3 V to +21 V

MODE, COMP, REG, MIN, DIM, VT, ISET to

GND

−0.3 V to +3.6 V

EN,

FAULTE

, VO_SNS to GND

−0.3 V to +6.0 V

Operating Ambient Temperature Range

–40°C to +105°C1

Operating Junction Temperature Range

–40°C to +125°C

Maximum Junction Temperature

150°C

Storage Temperature Range

–45°C to +150°C

Soldering Conditions

JEDEC J-STD-020

ESD (Electrostatic Discharge)

Human Body Model (HBM)

±1.5 kV

Charged Device Model (CDM)

±500 V

1 The maximum operating junction temperature (TJ(MAX)) supersedes the

maximum operating ambient temperature (TA(MAX)). See the Maximum

Temperature Ranges section for more information.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

Absolute maximum ratings apply individually only, not in

combination. Unless otherwise specified, all voltages are

referenced to GND.

MAXIMUM TEMPERATURE RANGES

The maximum operating junction temperature (TJ(MAX))

supersedes the maximum operating ambient temperature

(TA(MAX)). Therefore, in situations where the ADP8140 is

exposed to poor thermal resistance and a high power dissipa-

tion (PD), the maximum ambient temperature may need to be

derated. In these cases, the ambient temperature maximum can

be calculated with the following equation:

TA(MAX) = TJ(MAX) − (θJA × PD(MAX))

THERMAL RESISTANCE

θJA (junction to air) is specified for the worst-case conditions,

that is, a device soldered in a circuit board for surface-mount

packages. The θJA, θJB (junction to board), and θJC (junction to

case) are determined according to JESD51-9 on a 4-layer

printed circuit board (PCB) with natural convection cooling.

The LFCSP exposed pad must be soldered to GND.

Table 3. Thermal Resistance

Package Type

θJA

θJB

θJC

Unit

16-Lead LFCSP

33.2

12.4

2.4

°C/W

ESD CAUTION

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