MPC8347ECVRADDB datasheet(85/99 Pages) NXP

85 / 99 page

MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 12

Freescale Semiconductor

Thermal

Table 66 provides the package thermal characteristics for the 620 29

× 29 mm PBGA of the MPC8347EA.

20.2

Thermal Management Information

For the following sections, PD = (VDD × IDD) + PI/O where PI/O is the power dissipation of the I/O drivers.

See Table 5 for I/O power dissipation values.

Junction-to-package natural convection on top

°C/W

Notes:

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 66. Package Thermal Characteristics for PBGA

Parameter

Symbol

Value

Unit

Notes

Junction-to-ambient natural convection on single-layer board (1s)

RθJA

°C/W

1, 2

Junction-to-ambient natural convection on four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 200 ft/min) on single-layer board (1s)

RθJMA

°C/W

1, 3

Junction-to-ambient (at 200 ft/min) on four-layer board (2s2p)

RθJMA

°C/W

1, 3

Junction-to-board thermal

RθJB

°C/W

Junction-to-case thermal

RθJC

°C/W

Junction-to-package natural convection on top

°C/W

Notes

1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.

3. Per JEDEC JESD51-6 with the board horizontal.

4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 65. Package Thermal Characteristics for TBGA (continued)

Characteristic

Symbol

Value

Unit

Notes

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