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MPC8343ECVRADDB датащи(PDF) 51 Page - NXP Semiconductors |
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MPC8343ECVRADDB датащи(HTML) 51 Page - NXP Semiconductors |
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51 / 80 page ![]() MPC8343EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 11 Freescale Semiconductor 51 Package and Pin Listings 18.2 Mechanical Dimensions for the MPC8343EA PBGA Figure 36 shows the mechanical dimensions and bottom surface nomenclature for the MPC8343EA, 620-PBGA package. Notes: 1. All dimensions are in millimeters. 2. Dimensioning and tolerancing per ASME Y14. 5M-1994. 3. Maximum solder ball diameter measured parallel to datum A. 4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls. Figure 36. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC8343EA PBGA |
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