FEDL 2213-01

1Semiconductor

ML2213

25/26

SSOP14-P-44-0.65-K

Mirror Finish

Package material

Epoxy resin

Lead frame material

42 alloy

Pin treatment

Solder plating (

≥5µm)

Package weight (g)

0.066 TYP.

5

Rev. No./Last Revised

1/Sept. 18, 1998

Notes for Mounting the Surface Mount Type Package

The surface mount type packages are very susceptible to heat in reflow mounting and humidity

absorbed in storage.

Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the product

name, package name, pin number, package code and desired mounting conditions (reflow method,

temperature and times).

(Unit: mm)