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MSCSM170AM45CT1AG датащи(PDF) 12 Page - Microchip Technology |
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MSCSM170AM45CT1AG датащи(HTML) 12 Page - Microchip Technology |
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12 / 17 page ![]() 2. Package Specifications The following section shows the package specification of the MSCSM170AM45CT1AG device. 2.1 Package Outline The following figure shows the package outline drawing of the MSCSM170AM45CT1AG device. The dimensions in the following figure are in millimeters. Figure 2-1. Package Outline Drawing Note: See AN3500A—Mounting Instructions for SP1F and SP3F Power Modules for more information. MSCSM170AM45CT1AG Package Specifications © 2021 Microchip Technology Inc. Datasheet DS00003938A-page 12 |
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