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MIC9130 датащи(PDF) 4 Page - Micrel Semiconductor |
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MIC9130 датащи(HTML) 4 Page - Micrel Semiconductor |
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4 / 19 page ![]() MIC9130 Micrel, Inc. M9999-040805 4 April 2005 Parameter Condition Min Typ Max Units Preregulator Input Leakage Current VLINE = 180V, VCC = 10V 0.1 10 µA VCC Gate Lockout (VGLO(ON)) VLINE = 48V 7.2 7.5 V VCC Gate Lockout Hysteresis VLINE = 48V 700 800 mV (ΔVGLO) VCC Pre-Regulator Off (VPR(OFF)) VLINE = 48V VGLO(ON) V 7.7 +0.5V VCC Pre-Regulator Hysteresis VLINE = 48V 500 700 mV (ΔVPR) Start-up Current VLINE = 48V, VCC = 7.5V, Note 4 9 12 mA Supply Supply Current, IVCC Pin 16 (OUT) = OPEN 1.3 1.5 mA Enable Input Current VEN = 0V ,10V; VLINE = 48V –10 0.1 10 µA Shutdown Supply Current VEN = 0V ; VCC = 18V 0.1 10 µA Protection and Control Current Limit Threshold Voltage 0.772 0.83 0.888 V Current Limit Delay to Output VISNS = 0V to 5V 34 ns Current Limit Source Current VISNS = 0V 30 40 50 µA Enable Input Threshold (Turn-on) 1 1.6 2.2 V Enable Input Hysteresis 150 mV CPWR Input Current VCPWR = 5V, 0V –1 +1 µA CPWR Threshold 1.6 V Soft-Start Current VSS = 0V 2.5 4 6 µA Line UVLO Threshold (Turn-on) 1.16 1.22 1.28 V Line UVLO Threshold Hysteresis 140 mV Thermal Shutdown 145 °C Thermal Shutdown Hysteresis 25 °C MOSFET Driver Output Minimum On-Time VISNS = 5V 21 ns Output Driver Impedance SOURCE ; ISOURCE = 200mA 8 12 Ω SINK ; ISINK = 200mA 4 6 Ω Rise Time COUT = 500pF 12 ns Fall Time COUT = 500pF 8 ns Note 1. Exceeding the absolute maximum rating may damage the device. Note 2. The device is not guaranteed to function outside its operating rating. Note 3. Devices are ESD sensitive. Handling precautions recommended. Note 4. If a substained DC voltage >150V is applied to the LINE pin, a current-limiting 1.8kΩresistor should be used in series with the LINE pin. This condition does not apply for transient conditions over 150V. Note 5. For oscillator frequencies above 2.5MHz it may be necessary to power to VBIAS pin from an external power source due to the current limita- tions of the internal 5V regulator. See Applications Information for details |
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