LMY datasheet(4/8 Pages) LEIDITECH

4 / 8 page

9 Reliability Of Ferrite Multilayer Chip Bead

1-1.Mechanical Performance

Item

Specification

1-1-1 Flexure Strength

The forces applied on the right

Test device shall be soldered on the substrate

conditions must not damage

Substrate Dimension: 100x40x1.6mm

the terminal electrode and the Deflection: 2.0mm

ferrite

Keeping Time: 30sec

*For 100505, substrate dimension is 100x40x0.8mm

1-1-2 Vibration

Test device shall be soldered on the substrate

Oscillation Frequency: 10 to 55 to 10Hz for 1min

Amplitude: 1.5mm

Time: 2hrs for each axis (X, Y & Z), total 6hrs

1-1-3 Resistance to Soldering Heat Appearance: No damage

Pre-heating: 150

℃, 1min

More than 75% of the terminal.Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)

electrode should be covered

Solder Temperature: 260±5

℃

with solder.

Immersion Time: 10±1sec

Impedance : within ±30% of

initial value

1-1-4 Solder ability

The electrodes shall be at

Pre-heating: 150

℃, 1min

least 95% covered with new

Solder Composition: Sn/Ag3.0/Cu0.5(Pb-Free)

solder coating

Solder Temperature: 245±5

℃(Pb-Free)

Immersion Time: 4±1sec

1-1-5 Terminal Strength Test

No split termination

Test device shall be soldered on the substrate,

then apply a force in the direction of the arrow.

Force : 5N

Keeping Time: 10±1sec

1-2.Environmental Performance

Item

Specification

1-2-1 Temperature Cycle

Appearance: No damage

One cycle:

Impedance: within±30% of

Step

Temperature (

℃)

Time (min)

initial value

-55±3

25±2

125±3

25±2

Total: 100cycles

Measured after exposure in the room condition for 24hrs

1-2-2 Humidity Resistance

Temperature: 40±2

℃

Relative Humidity: 90 ~ 95% / Time: 1000hrs

Measured after exposure in the room condition for 24hrs

1-2-3 High

Temperature: 125±3

℃ / Relative Humidity: 0%

Temperature Resistance

Applied Current: Rated Current /Time: 1000hrs

Measured after exposure in the room condition for 24hrs

1-2-4 Low

Temperature: -55±3

℃

Temperature Resistance

Relative Humidity: 0% / Time: 1000hrs

Measured after exposure in the room condition for 24hrs

Test Method

Mounting Pad

Chip

LMY Series

Rev :

www.leiditech.com

01.06.2018

4/8

LMY датащи(PDF) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd

LMY датащи(HTML) 4 Page - Shanghai Leiditech Electronic Technology Co., Ltd

Html Pages

1 2 3 4 5 6 7 8

датащи скачать

ссылки URL