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FDMC0310AS датащи(PDF) 2 Page - ON Semiconductor |
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FDMC0310AS датащи(HTML) 2 Page - ON Semiconductor |
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2 / 8 page ![]() ©2013 Semiconductor Components Industries, LLC. August-2017, Rev.3 FDMC0310AS N-Channel PowerTrench® SyncFETTM 30 V, 21 A, 4.4 m Ω Features Max rDS(on) = 4.4 mΩ at VGS = 10 V, ID = 19 A Max rDS(on) = 5.2 mΩ at VGS = 4.5 V, ID = 17.5 A Advanced package and silicon combination for low rDS(on) and high efficiency SyncFETTM Schottky Body Diode MSL1 robust package design 100% UIL tested RoHS Compliant General Description The FDMC0310AS has been designed to minimize losses in power conversion application. Advancements in both silicon and package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance.This device has the added benefit of an efficient monolithic schottky body diode. Applications Synchronous Rectifier for DC/DC Converters Notebook Vcore/GPU low side switch Networking Point of Load low side switch Telecom secondary side rectification MLP 3.3x3.3 Bottom D D D D S S S G Top Pin 1 G S S S D D D D 5 6 7 8 3 2 1 4 MOSFET Maximum Ratings T A = 25 °C unless otherwise noted Thermal Characteristics Package Marking and Ordering Information Symbol Parameter Ratings Units VDS Drain to Source Voltage 30 V VDSt Drain to Source Transient Voltage ( t Transient < 100 ns) 33 V VGS Gate to Source Voltage (Note 4) ±20 V ID Drain Current -Continuous TC = 25°C 21 A -Continuous TA = 25°C (Note 1a) 19 -Pulsed 100 EAS Single Pulse Avalance Energy (Note 3) 66 mJ PD Power Dissipation TC = 25°C 36 W Power Dissipation TA = 25°C (Note 1a) 2.4 TJ, TSTG Operating and Storage Junction Temperature Range -55 to +150 °C RθJC Thermal Resistance, Junction to Case 3.4 °C/W RθJA Thermal Resistance, Junction to Ambient (Note 1a) 53 Device Marking Device Package Reel Size Tape Width Quantity FDMC0310AS FDMC0310AS MLP 3.3X3.3 13 ’’ 12 mm 3000 units Publication Order Number: FDMC0310AS/D |
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