II. Manufacturing Information

A. Description/Function:

1-Phase Quick-PWM Intel IMVP-6.5/GMCH Controller

B. Process:

S4

C. Number of Device Transistors:

10146

D. Fabrication Location:

Texas

E. Assembly Location:

ASAT China, UTL Thailand

F. Date of Initial Production:

2008

III. Packaging Information

A. Package Type:

32-pin TQFN 5x5

B. Lead Frame:

Copper

C. Lead Finish:

100% matte Tin

D. Die Attach:

Conductive Epoxy

E. Bondwire:

Gold (1.0 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

#05-9000-2634

H. Flammability Rating:

Class UL94-V0

MAX17428GTJ+

I. Classification of Moisture Sensitivity per

JEDEC standard J-STD-020-C

Level 1

J. Single Layer Theta Ja:

47°C/W

K. Single Layer Theta Jc:

1.7°C/W

L. Multi Layer Theta Ja:

29°C/W

M. Multi Layer Theta Jc:

2.7°C/W

IV. Die Information

A. Dimensions:

77 X 73 mils

B. Passivation:

C. Interconnect:

Aluminum/0.5% Cu

D. Backside Metallization:

None

E. Minimum Metal Width:

Metal1 = 0.5 / Metal2 = 0.6 / Metal3 = 0.6 microns (as drawn)

F. Minimum Metal Spacing:

Metal1 = 0.45 / Metal2 = 0.5 / Metal3 = 0.6 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

I. Die Separation Method:

Wafer Saw

Maxim Integrated Products. All rights reserved.

Page 3/5