поискавой системы для электроныых деталей
  Russian  ▼
ALLDATASHEETRU.COM

X  

Preview PDF HTML

USB2640 датащи(PDF) 55 Page - Microchip Technology

номер детали USB2640
подробное описание детали  Ultra Fast USB 2.0 Multi-Format Flash Media Controller/USB Hub Combo
PDF  60 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB2640 датащи(HTML) 55 Page - Microchip Technology

Back Button USB2640 Datasheet HTML 51Page - Microchip Technology USB2640 Datasheet HTML 52Page - Microchip Technology USB2640 Datasheet HTML 53Page - Microchip Technology USB2640 Datasheet HTML 54Page - Microchip Technology USB2640 Datasheet HTML 55Page - Microchip Technology USB2640 Datasheet HTML 56Page - Microchip Technology USB2640 Datasheet HTML 57Page - Microchip Technology USB2640 Datasheet HTML 58Page - Microchip Technology USB2640 Datasheet HTML 59Page - Microchip Technology Next Button
Zoom Inzoom in Zoom Outzoom out
 55 / 60 page
background image
 2015-2021 Microchip Technology Inc.
DS00001947C-page 55
USB2640/USB2641
Note:
This product is a variant ‘C’.
FIGURE 11-1:
USB2640/USB2641 48-PIN QFN, 7 X 7 MM BODY, 0.5 MM PITCH (CONTINUED)
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
See Center
MILLIMETERS
0.50 BSC
MIN
E
MAX
6.90
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.85
0.30
Microchip Technology Drawing C04-2223B
NOM
SILK SCREEN
1
2
48
C1
C2
E
X1
Y1
G1
Y2
X2
C1
Contact Pad Spacing
6.90
Contact Pad to Center Pad (X48)
G1 0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
ØV
EV
EV
48-Lead Plastic Quad Flat, No Lead Package (RS) - 7x7 mm Body [VQFN]
With Exposed Pad; Punch Singulated (AIS Package HZH)
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
Pad Variations
5.60
C
5.40
5.20
4.20
G
H
K
X2
5.60
5.40
5.20
4.20
Y2
Symbol
Center Pad Variations
MIN NOM MAX MIN NOM MAX
Variant



Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60


датащи скачать

Go To PDF Page


ссылки URL



Вашему бизинису помогли Аллдатащит?  [ DONATE ] 

Что такое Аллдатащит   |   реклама   |   контакт   |   Конфиденциальность   |   Ссылка на техническое описание    |   обмен ссыками   |   поиск по производителю
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com