Recommended Soldering Conditions

Flow Soldering Conditions

Hand Soldering

Solder iron temperature: 350±5℃

Heating time: 3 seconds max.

General attention to soldering

1.High soldering temperatures and long soldering times can cause

leaching of the termination, decrease in adherence strength, and

the change of characteristic may occur.

2.For soldering, please refer to the soldering curves above.

However, please keep exposures to temperatures exceeding 200℃

to fewer than 50 seconds.

3.Please use a mild flux (containing less than 0.2wt% CI). Also, if

the flux is water soluble, be sure to wash thoroughly to remove any

residue from the underside of components that could affect

resistance.

1) Time shown in the above figures is measured from the point when chip surface reaches temperature.

2) Temperature difference in high temperature part should be within 110℃

3) After soldering, do not force cool, allow the parts to cool gradually.

Cleaning

When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or a decrease

in the adherence of the termination, we recommend that you use the conditions below.

Frequency: 40kHz max.

Output power: 20W/liter

Cleaning time: 5 minutes max.

Dimensions

DIM

Millimeters

Inches

A

5.0

±0.5

0.197

±0.02

C

Φ2.6±0.5

0.102

±0.02

D

Φ2.7±0.5

0.106

±0.02

250

200

150

100

50

0

150~180℃

Air Priheat

260℃

T

Soldering

Cooling

3~4 sec

60~120 sec

LM102 Series

Rev :

www.leiditech.com

01.06.2018

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