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USB82642 датащи(PDF) 53 Page - Microchip Technology

номер детали USB82642
подробное описание детали  Automotive USB 2.0 Hub and Flash Media Card Controller Combo
PDF  64 Pages
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производитель  MICROCHIP [Microchip Technology]
домашняя страница  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

USB82642 датащи(HTML) 53 Page - Microchip Technology

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2012-2021 Microchip Technology Inc.
DS60001253F-page 53
USB82642
FIGURE 10-3:
USB82642AM/AMR 48-PIN VQFN LAND PATTERN
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
See Center
MILLIMETERS
0.50 BSC
MIN
E
MAX
6.90
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
0.85
0.30
Microchip Technology Drawing C04-2223B
NOM
SILK SCREEN
1
2
48
C1
C2
E
X1
Y1
G1
Y2
X2
C1
Contact Pad Spacing
6.90
Contact Pad to Center Pad (X48)
G1 0.20
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
ØV
EV
EV
48-Lead Plastic Quad Flat, No Lead Package (RS) - 7x7 mm Body [VQFN]
With Exposed Pad; Punch Singulated
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
Pad Variations
5.60
C
5.40
5.20
4.20
G
H
K
X2
5.60
5.40
5.20
4.20
Y2
Symbol
Center Pad Variations
MIN NOM MAX MIN NOM MAX
Variant



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