DA14531MOD

Final

Datasheet

Revision 3.1

31-May-2021

CFR0011-120-00

3 of 32

© 2021-2021 Dialog Semiconductor

Contents

General Description ............................................................................................................................ 1

Key Features ........................................................................................................................................ 1

Applications ......................................................................................................................................... 2

1

References ..................................................................................................................................... 5

2

Block Diagram ............................................................................................................................... 6

3

Pinout ............................................................................................................................................. 7

4

Characteristics .............................................................................................................................. 9

4.1

Absolute Maximum Ratings .................................................................................................. 9

4.2

Recommended Operating Conditions ................................................................................. 10

4.3

Device Characteristics ........................................................................................................ 10

5

Mechanical Specifications.......................................................................................................... 13

5.1

Dimensions ......................................................................................................................... 13

5.2

PCB Footprint...................................................................................................................... 14

5.3

Marking................................................................................................................................ 14

6

Packaging Information................................................................................................................ 15

6.1

Tape & Reel ........................................................................................................................ 15

6.2

Labeling............................................................................................................................... 16

7

Application Information .............................................................................................................. 16

8

Design Guidelines ....................................................................................................................... 17

8.1

Installation Location ............................................................................................................ 17

8.2

Antenna Graphs .................................................................................................................. 18

8.3

Radiation Pattern ................................................................................................................ 19

9

Soldering ...................................................................................................................................... 22

10 Ordering Information .................................................................................................................. 23

11 Regulatory Information ............................................................................................................... 23

11.1 CE (Radio Equipment Directive 2014/53/EU (RED)) - (Europe)......................................... 24

11.2 FCC - (U.S.A.) ..................................................................................................................... 25

11.3 IC (CANADA) ...................................................................................................................... 25

11.4 MIC (JAPAN)....................................................................................................................... 26

11.5 NCC (Taiwan) ..................................................................................................................... 27

11.6 MSIP (South Korea) ............................................................................................................ 27

11.7 Australia/ New Zealand (RCM) ........................................................................................... 28

11.8 South Africa (ICASA) .......................................................................................................... 28

11.9 Brazil (Anatel)...................................................................................................................... 28

11.10 China (SRRC) ..................................................................................................................... 29

11.11 Thailand (NBTC) ................................................................................................................. 29

11.12 India (WPC)......................................................................................................................... 29

12 Environmental Information......................................................................................................... 29

13 Bluetooth® SIG Qualification...................................................................................................... 29

Revision History ................................................................................................................................ 31